Author: Luoxiaolong

Leading the Future with Innovation, Keysight Technology Targets 6G, Autonomous Driving, Quantum Information, New Space

Recently, Keysight Technologies held the annual event Keysight World 2020 in Shanghai. The theme of the conference was “Innovate Next”, and many industry leaders, partners, customers and innovators were invited to gather together to deepen the Discuss the latest trends in the industry, accurately target design and testing trends, and share cutting-edge technological innovation hotspots, covering 5G design and deployment, automotive electronics and new energy vehicles, cutting-edge research, high-speed digital and information security and many other technical fields.

At the meeting, Zheng Jifeng, general manager of Keysight’s Greater China market, pointed out that new technological developments are bringing new opportunities to Keysight. These new development opportunities include 6G, quantum computing, automotive electronics, and new space.

Zheng Jifeng, General Manager, Greater China, Keysight Technologies

For example, he said: “It is predicted that the field of wireless communication may bring a market opportunity of more than 3.6 trillion US dollars in the next 15 years. For IoT (Internet of Things), there may be more than 100 per second in the future. Opportunity access to the Internet of Things. And quantum information, in the future, the investment will reach the level of more than 10 trillion US dollars.”

This year is the first year of large-scale commercial use of 5G, and network openness has become a new trend. A long time ago, Keysight joined O-RAN, an organization that advocates network openness. Keysight Technologies wireless application technical support manager Gu Hongliang said that in the 5G era, the open network concept was proposed by the Open-RAN organization, which provides unified technical standards and constitutes an open network based on SDN (software-defined networking) and NFV (network function virtualization). The network, the open network has its advanced nature, but the implementation of the test level has increased the difficulty. Because each manufacturer only does part of it, there are multiple devices and different devices in a network, and the test environment is much more responsible than before. In response to this situation, Keysight’s solution is to sink in the internals, and proposes a solution to each 5G network. A test plan for a device or node (called a component) can eventually be integrated to complete a network-wide test. Gu Hongliang emphasized that Keysight is the only manufacturer that has solutions for each component in the 5G network.

Hongliang Gu, Technical Support Manager for Wireless Applications, Keysight Technologies

As one of the commanding heights of next-generation technology development, 6G technology also has a layout. Zheng Jifeng said that 6G can bring us a new experience, perhaps higher speed, or ultra-low latency, ultra-large-scale IoT, and possibly heterogeneous services. However, the realization of 6G will obviously not be smooth sailing, and higher requirements are put forward for modules, chips or system design.

In August 2019, Keysight Technologies announced as a co-founding member of the multi-party 6G flagship program, which is strongly supported by the Academy of Finland and led by the University of Oulu, Finland, to promote new wireless communication technologies beyond 5G Research to prepare for the future 6G landing.

In terms of quantum computing, it is also one of the focuses of future scientific and technological development. Zheng Jifeng pointed out that in the future, if we use quantum search algorithms, it can successfully crack almost all of our passwords today, because its computing power is very powerful. . To this end, Keysight Technologies has acquired two companies, Labber Quantum and Signadyne, which have greatly completed its testing solutions in quantum information through mergers and acquisitions. Not only that, Keysight has also established a dedicated quantum information research and development team near the Massachusetts Institute of Technology (MIT) and Lincoln Laboratory.

In terms of automotive electronics, Keysight also chose to make arrangements in advance.Zheng Jifeng said that two years ago, Keysight Technology acquired Scienlab, a company specializing in testing solutions for new energy vehicles.

German technology about new energy vehicle testing solutions. At the same time, Keysight has established new energy and automotive electronics customer solution centers in four cities around the world, namely Michigan in the United States, Boblingen in Germany, Nagoya in Japan, and Shanghai in China.

Du Jiwei, Marketing Manager of Automotive and New Energy Testing Solutions at Keysight Technology Greater China, said that Keysight Technology needs to help customers build a complete laboratory, starting from the planning of air conditioning, cooling systems, and sewer systems, to the completion of the entire laboratory. Detech should participate in the whole process to ensure that the customer’s power battery testing process is flawless, and also reduce the labor input of the customer’s self-built laboratory.

Du Jiwei, Marketing Manager, Automotive and New Energy Testing Solutions, Keysight Technologies Greater China

Of course, there is also the new space. Zheng Jifeng said that in the future, the number of satellites launched in space may increase exponentially compared with today. In the future, there may be tens of thousands or even tens of thousands of satellites orbiting the sky above the earth, truly realizing the so-called integration of heaven and earth. It can also bring opportunities.

At the meeting, Keysight also took this conference to show the media the excellent products of Keysight this year, including the 8-in-1 MXR series oscilloscope, the signal analyzer MXA and network analyzer PNA/PNA, which have always been at the leading level in the industry. -X’s latest breakthrough.

The most important new product launched by Keysight in 2020 is the MXR multi-function oscilloscope, which combines eight instruments including oscilloscope, logic analyzer, protocol analyzer, digital voltmeter, frequency meter, function generator, frequency response analyzer and real-time spectrum analyzer. All in one. According to Huang Teng, Digital Test Product Manager of Keysight Technology Greater China, digital products are going wireless, and the combination of time domain and frequency domain analysis is becoming more and more popular. In the past, digital engineers were good at analyzing time domain equipment, but lacked frequency domain analysis. MXR’s integrated real-time spectrum function solves this problem, providing digital engineers with a pan-signal analysis device that can easily span from the time domain to the frequency domain.

Teng Huang, Digital Test Product Manager, Greater China, Keysight Technologies

The Fault Hunter function is also integrated on the MXR. The waveform refresh rate can reach up to 200,000 times per second, which can greatly reduce the dead time of the oscilloscope. By capturing more continuous data, it is very convenient to catch the problem waveform. Aiming at the problem that it is difficult to set trigger conditions for capturing problematic waveforms, Fault Hunter also optimizes the trigger settings, so that users can easily set trigger conditions and quickly capture the desired waveform.

At the meeting, Zheng Jifeng emphasized the importance of innovation. He pointed out that DeTech has now invested in the research and development of emerging technologies such as 6G mobile communication technology and quantum computing. At the same time, Keysight also attaches great importance to emerging technologies such as quantum computing. Keysight has always maintained corresponding R&D investment for continuous innovation.

Leading the future with innovation, Keysight is embracing the next wave of technology.

The Links:   G084SN05-V8 2MBI200SB120

How augmented reality-assisted surgery is revolutionizing the medical industry

Recently, the augmented reality (AR) knee arthroplasty navigation system Knee+ from French company Pixee Medical received CE certification, which is the first orthopaedic navigation system approved to use augmented reality (AR) in total knee arthroplasty. Similar applications of augmented reality technology in surgical navigation are booming around the world. Augmented reality-assisted surgical technology is of great significance for preoperative planning, intraoperative guidance and postoperative rehabilitation. This article will explain the basic concepts, technical principles, market conditions, major companies and representative products, and describe the future development is discussed.

1. Basic Concepts

1. Augmented Reality (AR)

Augmented reality (AR) is a technology that superimposes computer-processed images of virtual models into real scenes to enhance real scenes. It enhances people’s perception of the real world around them, and integrates simulated scenes, objects, and related prompt information (such as sound, video, graphics or GPS data) into the real scene to enhance the effect. The fundamental discipline of augmented reality (AR) technology is computer vision. It uses tools such as displays, cameras and sensors to overlay digital information onto the real world.

  How augmented reality-assisted surgery is revolutionizing the medical industry

2. Surgical navigation system

Surgical navigation is a technology that accurately corresponds the image data of the patient before or during the operation with the patient’s anatomical structure, tracks the instruments during the operation, and updates and displays their position on the patient’s image in real time in the form of a virtual probe. Surgical navigation enables doctors to see the location of instruments at a glance, making surgery faster, more precise, and safer. After years of development, surgical navigation has become the standard for neurosurgical treatment and is gradually gaining popularity in other fields. Currently in the US surgical navigation market, 578,375 procedures are performed each year, which is expected to grow to 718,224 by 2025. In the United States, surgical navigation is most commonly used in neurosurgery, accounting for approximately 43.3% of the total number of cases; in Europe, the most common is total knee arthroplasty (TKA).

2. Technical principle

Augmented reality surgical navigation system includes three cores: virtual image or environment modeling, virtual environment and real space registration, and Display technology that combines virtual and real environments.

1. Virtual image or environment modeling

AR systems use color or texture distinctions between anatomical structures in CT or MRI tomography and angiography to accomplish 3D reconstruction of subsurface objects in a computer. Non-realistic rendering or inverted reality techniques can improve visualization and depth perception.

2. Registration of virtual environment and real space

Registration can be accomplished by a variety of means, and a three-dimensional Cartesian system based on frame technology can determine the position and attitude of the imaging device.

3. Display technology that combines virtual and real environments

Display technology can be broadly classified into head-mounted displays (HMDs), enhanced external displays, enhanced optical systems, enhanced window displays, and image projection. Using HMD, the virtual environment can be covered not only in the real world under the user’s field of vision (optical perspective), but also in the video source of the real environment (video perspective). Augmented displays are simple stand-alone screens that display virtual content over real-world video. Optically enhanced displays refer to the direct enhancement of the eyepieces of a surgical microscope or binocular. Window-enhanced display is the placement of a translucent screen directly over the surgical site, allowing virtual objects to be displayed directly on the screen over real objects. The virtual environment can be projected directly onto the patient with a projector.

3. Market situation

Augmented reality (AR) applications in the medical market are growing strongly with an expected CAGR of 33.36%, and the market value is expected to grow from $627 million in 2018 to $3.497 billion in 2024. AR technology is gaining a lot of attention from physicians due to its wide range of applications, from assessing surgical preparation to minimally invasive surgery and rehabilitation. Furthermore, according to ResearchandMarkets, the global surgical imaging market size is expected to reach USD 1.7 billion by 2025, growing at a CAGR of 5.4% during the forecast period. The latest role and integration of augmented reality (AR) in healthcare is enhancing the surgical experience. The rapid development of real-time visualization platforms has also led to better surgical treatments. Furthermore, increasing government funding, growing prevalence of sports injuries, and expanding geriatric population are factors contributing to the growth of the global surgical imaging market. Based on application, the market is segmented into neurosurgery, orthopedic and trauma surgery, cardiac and vascular surgery, general surgery, and other surgeries.

4. Main companies and representative products

1. Knee+ system of Pixee Medical

Founded in France in October 2017, PixeeMedical aims to leverage existing advanced computer vision and artificial intelligence technologies to create high-performance computer-assisted surgical solutions while keeping prices affordable in challenging health system environments. Knee+ just recently received CE certification for augmented reality knee arthroplasty navigation. This is the first orthopaedic navigation system to use augmented reality (AR) in total knee arthroplasty. FDA 510(k) approval for the system is currently being sought.

Knee+ patented technology combines proprietary computer vision and deep learning algorithms to work with off-the-shelf AR glasses to track instruments and implants during surgery. Navigation software installed in the smart glasses is combined with a reduced-scale MIS instrument with markers that can be sterilized in an autoclave. Size and ligament balance features can be quickly integrated into the product. As an alternative to bulky and expensive robotic systems, the Knee+ is simple to use, cost-effective, and does not require preoperative DICOM or disposable equipment. Future applications may be introduced into shoulder and hip surgery.

2. XVisionSpine system from Augmedics

Augmedics is a company dedicated to the development of surgical treatment technology, established in 2014. The first product, the xvision-spine (XVS) system, is an augmented reality surgical navigation system. With the XVS system, surgeons can see the real-time position and trajectory of surgical tools under the skin and tissue and navigate inside the patient, making surgery easier, faster and safer. The XVS uses patented see-through optics to project 3D images, as well as axial and sagittal planes, onto the surgeon’s retina in real time with surgical precision and excellent depth perception.

The XVS system includes a transparent near-eye display headset and has all the elements of a traditional navigation system. It accurately determines the location of surgical tools in real-time and superimposes it on the patient’s computed tomography data. The navigation data is then projected onto the surgeon’s retina using a transparent near-eye display headset, allowing the surgeon to simultaneously gaze at the patient and view the navigation data without having to move the eye to a remote screen. In a study conducted at Rush University Medical Center in Chicago, XVision was found to increase surgeon accuracy to an impressive 98.9 percent. The accuracy of the entire system is about 1.4 mm, which meets the US FDA’s requirement of less than 2 mm.

3. VOSTARS Video Optical Perspective Augmented Reality Surgical System

VOSTARS is an innovative action project funded by the Horizon 2020 program. Augmented reality (AR) surgical goggles developed by European scientists are able to see X-ray images and all key data perfectly superimposed in 3D with anatomical structures at once, and move freely at the same time. The VOSTARS Video Optical Fluoroscopy Augmented Reality Surgical System will conveniently display the patient’s anesthesia data, heart rate, body temperature, blood pressure and respiratory rate, etc. within the surgeon’s field of vision. Surgical accuracy will be significantly improved while reducing surgical time (20 minutes for every three-hour procedure), time under anesthesia and the costs involved in any surgery. The project plans to achieve mass production in 2022.

The system combines two existing AR technologies: video see-through (VST) and optical see-through (OST). Neither VST nor OST alone are suitable for surgery on live patients. OST systems such as Microsoft Hololens use translucent mirror surfaces to provide users with a direct view of the natural environment by superimposing computer-generated images on the user’s field of vision. VST systems such as the OcculusRift submerge the user in a virtual world with an enclosed head-mounted display (HMD) and stereoscopic cameras and screens.

4. TrueVision? 3DSurgical system

TrueVision™ 3DSurgical is the global leader in digital 3D visualization and the benchmark for microsurgery. Founded in 2003 and headquartered in Santa Barbara, California, TrueVision® helps doctors perform microsurgery through a self-developed digital 3D visualization platform. The intelligent, real-time, 3D visualization surgery and computer-aided guidance platform developed by the company has been patented.

The system enables surgeons to record surgical procedures in 3D and stream them live, making it an entirely new teaching tool. The company has developed a 3D guidance application for microsurgery that can improve surgical efficiency and patient outcomes. The system can be used in microsurgery, ophthalmology, and neurology, and can be integrated with a variety of application platforms and, in some cases, robotic surgery. The system is used by hundreds of mainstream hospitals and institutions around the world.

5. Discussion on the future development of augmented reality (AR) surgical navigation system

The application of augmented reality in clinical surgery spans many disciplines such as computer science, computer vision, sensors, communications, clinical medicine, and ergonomics, and the technology covers a wide range of areas. It can be seen from the following roadmap of augmented reality (AR)-assisted surgery: future tracking technology and image processing will be more inclined to intelligent technologies represented by deep learning, displays and sensors will be more inclined to technologies that are highly related to human organs, Such as retina display and human-computer symbiosis technology.

  

At the same time, there are challenges and obstacles in the development of augmented reality-assisted surgery. For example, for some display technologies, there are challenges in displaying 3D virtual objects as real-world images; time synchronization between virtual and real environments is another challenge for all AR systems. , especially rapid fluoroscopy changes; in the process of surgery, in some cases, image composite needs to be performed by a professional computer team; the compatibility and interoperability between the augmented reality surgical navigation system and related equipment and solutions need to be optimized improvement; data privacy issues, etc.

Epilogue

Medical surgery navigation is one of the important applications of augmented reality technology. In the era of image-guided surgery, augmented reality (AR) technology represents the next frontier in incorporating guidance systems into surgical workflows. With the rapid development of display technology and interactive technology, the role of augmented reality (AR) in the modern surgical operating room will increase.

The Links:   AD1580ART AND10C209A-HB

Dalian Dapinjia Group Launches EVB, a Touch Sensing Design Solution Based on Microchip Products

On October 15th, 2021, the leading semiconductor component distributor dedicated to the Asia-Pacific market, General Assembly Holdings, announced that its subsidiary Pinjia has launched a touch-sensing design solution EVB based on Microchip’s ATTINY1616.

Dalian Dapinjia Group Launches EVB, a Touch Sensing Design Solution Based on Microchip Products

Figure 1-Display board diagram of the touch-sensing design solution based on Microchip products by Dalian Dapinjia

Touch sensing is becoming a technological trend. It can be found in household appliances, portable Electronic products, or car control screens. The touch-sensitive design is favored by users due to its beauty and durability. In today’s rapidly changing market, manufacturers urgently need a high-performance touch sensing design to meet market demand. The touch sensing design solution EVB, launched by Dalian Dapinjia based on Microchip ATTINY1616 MCU, can help developers complete the design in a short period of time, thereby seizing the market.

  

Dalian Dapinjia Group Launches EVB, a Touch Sensing Design Solution Based on Microchip Products

Figure 2-Scenario application diagram of Dalian Dapinjia’s touch sensing design solution based on Microchip products

This solution uses an 8-bit MCU from Microchip-ATTINY1616. With the Atmel Studio development environment, it can easily realize the design of touch buttons, sliders, and scroll wheels. Microchip is a supplier of intelligent, connected and secure embedded control solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs, thereby reducing risk while reducing overall system costs.

As a touch sensing design, this solution uses the principle of self-capacitance sensing, that is, detecting changes in the sensor capacitance. There is a parasitic capacitance Cp between the Sensor (capacitive buttons and sliders) and the ground. When a touch occurs, a finger capacitance Cf will be formed, and the total capacitance Cs will change at this time. There are two kinds of Microchip capacitive sensing technology, one is based on mTouch? Technology CVD, and the other is QTouch? Technology PTC. The ATTINY1616 chip used this time is equipped with QTouch technology. It can be used for button, slider and scroll wheel design, and provides built-in hardware for capacitive touch measurement. PTC supports mutual capacitance and self-capacitance measurement, without any external components, can provide excellent sensitivity, noise immunity and self-calibration function, and can minimize the workload required for the user to adjust the sensitivity.

  

Dalian Dapinjia Group Launches EVB, a Touch Sensing Design Solution Based on Microchip Products

Figure 3-Block diagram of the touch sensing design solution based on Microchip products by Dalian Dapinjia

The noise problem is an unavoidable problem with capacitive touch. Both common mode noise and differential mode noise will affect the performance of touch keys. Therefore, designers need to consider noise immunity at the beginning of the design. This scheme can realize the anti-noise design well through hardware design + software debugging. In addition, the solution can also achieve a waterproof design by adding Driven Shield or Driven Shield+.

Core technical advantages:

Anti-noise ability:

High signal-to-noise ratio (SNR);

Passed IEC61000 EFT and BCI test.

Water resistant touch function:

The touch interface can be used normally under various environmental conditions (including wet surfaces), without the need to clean or dry hands each time the device is used.

Metal surface touch function, waterproof touch function:

Microchip provides metal surface capacitance (MoC) technology, which supports:

Metal surface: stainless steel or aluminum;

Can be tested through gloves of any thickness;

Waterproof design;

Support Braille interface.

Low power consumption:

The dedicated hardware on PIC, AVR and SAM devices supports the touch function with the lowest power consumption, and its capacitive sensing current is less than 5μA.

Support mutual capacitance touch sensing, can support multiple keys:

Microchip has optimized and enhanced the method of scanning a large number of buttons in a matrix. Costs can be saved in several ways:

Reduce the number of feed lines and simplify the connection of input and output (flexPCB) ports;

Reduce the number of pins required for touch, making the device cost-effective and occupying less space;

Through Microchip’s unique inherent feed line length compensation, the development time is greatly reduced.

Safety certified touch sensing function:

Microchip provides products (off-the-shelf products and sensor libraries) that have passed the IEC/UL 60730 safety class B standard certification.

Scheme specifications:

Microchip ATTINY1616:

Up to 12 self-capacitive keys/36 mutual-capacitive keys can be realized;

Designs such as sliders and rollers can be realized;

Support Driven Shield and Driven Shield+;

With I2C/SPI/UART interface;

There are car-regulated products.

  

The Links:   PM50RSA120 CM75DUM-12F IGBTMODULE

What should I pay attention to when installing an eddy current displacement sensor?

When using eddy current displacement sensor measurement equipment in industrial production, because it is a short-term temporary measurement, the correct installation of the eddy current displacement sensor is often not paid attention to, which causes significant test errors and brings trouble to vibration fault diagnosis and shafting balance. . In order to improve the accuracy and reliability of equipment vibration testing. The following is a brief introduction to the correct installation method and key points of the eddy current displacement sensor.

When using eddy current displacement sensor measurement equipment in industrial production, because it is a short-term temporary measurement, the correct installation of the eddy current displacement sensor is often not paid attention to, which causes significant test errors and brings trouble to vibration fault diagnosis and shafting balance. . In order to improve the accuracy and reliability of equipment vibration testing. The following is a brief introduction to the correct installation method and key points of the eddy current displacement sensor.

The installation of eddy current displacement sensor should pay attention to the following points:

1. Avoid resonance and loosening of structural supports

The vibration measurement frequency of the bracket of the sensor must be higher than the frequency corresponding to the maximum speed of the device, otherwise the measurement result will be distorted due to the resonance of the bracket. The American CTC factory stipulates that the natural vibration frequency of the eddy current displacement sensor bracket in the vibration measurement direction should be 10 times higher than the highest operating frequency of the machine, which is often difficult to achieve in actual operation. Generally, the natural vibration frequency of the bracket vibration measurement direction is higher than 2~ 3 times the working frequency of the rotational speed can basically meet the vibration measurement requirements.

In order to increase the natural vibration frequency, the structural support is generally made of flat steel with a thickness of 6~8mm, and the length of its cantilever should not exceed 100mm; when the cantilever is long, section steel, such as angle iron, I-beam, etc., should be used to effectively increase the natural vibration frequency of the bracket. In order to prevent the bracket or the eddy current displacement sensor from loosening during the test, the bracket must be fastened on the supporting part with good stability, preferably fixed on the bearing bush or bearing seat. The connection between the eddy current displacement sensor and the bracket should be tapping on the bracket. , and then tighten the nut, do not use the double nut to tighten the hole on the bracket.

2. Avoid cross-sensing and side clearance

When two eddy current displacement sensors installed vertically or in parallel are close to each other, cross-induction occurs between them, which will reduce the sensitivity of the sensor output. To avoid cross-sensing, the two sensors cannot be placed too close together. For different types of eddy-current displacement sensors, the required distance between the two sensors is different. Too small side clearance is mainly due to the presence of conductors on both sides of the sensor head, which significantly reduces the output sensitivity of the sensor. The correct side clearance b should be greater than or equal to d (sensor top coil diameter). The direction finding gap should not only consider the cold state, but also the expansion changes of the cylinder and rotor after heating. The exposed height c of the sensor head is generally not specified, but according to the field use, if c is too small, the sensitivity of the sensor will be significantly reduced.

3. Correct initial clearance

Various types of eddy current displacement sensors should have a certain gap voltage (the gap between the top of the sensor and the object to be measured, the general voltage is indicated on the meter), and the readings have good linearity, so the eddy current displacement sensor is installed. When displacing the sensor, an appropriate initial gap must be adjusted. The static maximum range of the eddy current sensor cannot be greater than 2.5mm. In order to obtain better linearity under dynamic conditions, its working gap should be within the range of 0.3~2.8mm, that is, the gap voltage indicated by the instrument is 2~16V.

What should I pay attention to when installing an eddy current displacement sensor?

After the rotor rotates and the equipment is loaded, the rotor will be displaced relative to the sensor. If the eddy current displacement sensor is installed on the top of the bearing, the gap will be reduced; if installed in the horizontal direction of the bearing, the gap depends on the direction of rotation of the rotor; when the direction of rotation is constant, the gap depends on whether it is installed on the right or left side . In order to obtain a suitable working clearance value, the rotor should be estimated from static to working speed during installation, and the journal lift should be about one-half of the top clearance of the bearing; 0.20mm. When the sensor is installed in the horizontal position on the right side, after the rotor rotates, the gap c increases; when it is installed on the left side, d decreases.

The displacement of the journal in the bearing bush is not only related to the speed, but also related to the active load of the equipment. For the low-mass turbine high-pressure rotor and the shaft with reducer, under the action of part of the steam inlet and gear transmission torque, the journal vertebra will be pushed to one side of the bearing bush, and the displacement value may be close to the diameter clearance of the bearing bush. When adjusting the initial gap of the sensor, in addition to the above factors, the maximum vibration value and the original sway value of the rotor should also be considered. The initial gap of the sensor should be greater than half of the maximum amplitude that the rotating shaft can produce and the original swing value of the rotating shaft.

4. Axial position selection

From the requirements of measuring shaft vibration, the shaft vibration measuring point should be as close to the center of the bearing bush as possible, but it is often limited by the installation position of the eddy current displacement sensor, and sometimes it has to maintain a certain distance from the bearing bush. It is obtained from the field vibration test that with the increase of the distance between the axonometric vibration point and the bearing bush, the shaft amplitude value will increase. Another consideration for the axial position of the axonometric vibration point is the machining accuracy of the rotating shaft and whether the magnetic permeability of the rotating shaft surface is uniform. Generally, before the formal installation, it is best to use a dial indicator to check the swing value of this point.

If the sway value is greater than 50u;m, another measuring point should be selected, otherwise the shaft sway value at low speed will be too large, and the displayed value of shaft vibration at high speed will appear unrealistic. The magnetic conductivity of the surface of the rotating shaft is not uniform, and it cannot be directly judged with the naked eye. Only after the excessive swing value of the rotating shaft is sent to be caused by the excessive mechanical swing of its surface can it be determined that the excessive vibration of the rotating shaft at low speed is caused by the surface of the rotating shaft. Caused by uneven magnetic conductivity, to eliminate this fault, only another measuring point location is selected.

5. Radial position selection

According to the requirements of the ISO DIS7919/2 specification, the installation of the shaft vibration sensor should satisfy that the two bearing sensors are on an axial plane and are perpendicular to each other.

Shenzhen Shensi Measurement and Control Technology Co., Ltd. is a high-tech enterprise specializing in sensor technology research and development, design, manufacturing and sales. The company’s main products are LVDT displacement sensor, eddy current displacement sensor, non-contact displacement sensor, contact displacement sensor, pull-rope displacement sensor, linear displacement sensor, high-precision displacement sensor, differential displacement sensor, resistive displacement sensor , Magnetostrictive liquid level sensor, capacitive liquid level sensor, inductive probe, etc. Products are widely used in machinery manufacturing, automobile, metallurgy, petroleum, chemical industry, scientific research institutes, aerospace, transportation construction and other fields.

The Links:   NL10276BC28-08B MBM150GS12AW LCD-DISPLAY

The first in China to open up the entire silicon carbide industry chain, and Sanan Integrated to complete the creation of a mass production platform

China’s compound semiconductor industry chain manufacturing platform, Sanan Integration, recently announced that it has completed the construction of a mass production platform for silicon carbide MOSFET devices. The first 1200V 80mΩ product has been developed and passed a series of product performance and reliability tests. It can be widely used in photovoltaic inverters, switching power supplies, pulse power supplies, high-voltage DC/DC, new energy charging and motor drives. Helps to reduce system volume, reduce system power consumption, and improve power system power density. At present, many customers are in the sample testing stage.

As China’s “14th Five-Year Plan” surfaced, investment in third-generation semiconductor projects has intensified. According to incomplete statistics, 8 companies plan to invest a total of more than 43 billion yuan in 2020, and the construction projects of silicon carbide and gallium nitride materials have experienced a “blowout”. Sanan Integrated said, “Healthy competition will help the upstream and downstream coordinated development of the industry chain. We will speed up the launch of new products and capacity building in order to maintain the first-mover advantage.” It is reported that Sanan integrated silicon carbide Schottky diodes in 2018. After the launch in 2010, the product line layout from 650V to 1700V has been completed, and the cumulative shipment has reached more than one million. The high reliability of the device has won unanimous praise from customers.

Compared with traditional silicon-based IGBT power devices, the 1200V80mΩ silicon carbide MOSFET launched this time, the wide bandgap silicon carbide material has “higher, faster and stronger” characteristics – higher withstand voltage and heat resistance, Faster switching frequency, lower switching losses. The excellent high temperature and high voltage characteristics make silicon carbide MOSFETs perform well in high-power applications, especially in high-voltage applications. Under the same power, silicon carbide MOSFETs have small device losses, which greatly reduces the heat dissipation requirements of the devices and makes the system Towards the direction of miniaturization, light weight and integration. This is very important for the power system of “an inch of land and an inch of gold”, such as new energy car charger OBC, server power supply, etc.

From SiC Schottky diodes to MOSFETs, Sanan Integrated has completed the layout of SiC device product lines within 3 years. On the premise of ensuring device performance, we provide high-quality and high-reliability silicon carbide products. The first industrial grade SiC MOSFET features a planar design with excellent body diode capability, high temperature DC characteristics, and excellent threshold voltage stability.

Stronger body diode capability

Due to the structure of the device, the body diode of the silicon carbide MOSFET is a PiN diode, and the turn-on voltage of the device is high and the loss is large. In actual use, the freewheeling current is often used in parallel with Schottky diodes to reduce system losses. By optimizing the device structure and layout, Sanan’s integrated silicon carbide MOSFET greatly enhances the current capacity of the silicon carbide body diode, does not require additional parallel diodes, reduces system cost, and reduces system volume.

Excellent threshold voltage stability

How to obtain a high-quality silicon carbide gate oxide structure is currently a common problem in the industry. The quality of the gate oxide will not only affect the channel current capacity of the MOSFET, but also cause the phenomenon of threshold shift, and even lead to reliability failure in severe cases. Through repeated tests and optimization of gate oxide conditions, Sanan integrated the stability of the threshold voltage has been significantly improved, and the threshold drift of 1000hr is within 0.2V.

21IC has noticed that compared with traditional silicon devices, the inherent performance advantages of silicon carbide have created a huge market demand for high-performance and high-efficiency applications. At present, there is a constant shortage of silicon carbide MOSFETs in the industry. The creation of a mass production platform for silicon carbide MOSFET devices is bound to accelerate the expansion of silicon carbide device production capacity and boost the application expansion of silicon carbide in more fields.

The Links:   PDTA115ET215 LJ640U21 LCD-INVERTER

Ziguang: Don’t even think about opening a 6nm chip without $200 million

2019 is the first year of 5G commercial use, and major mobile phone brands are rushing to launch 5G mobile phones. However, 5G is currently a feature only available on flagship phones. Therefore, when will 5G mobile phones be affordable to everyone has become a hot topic for many times.

From the perspective of 5G processors, perhaps when the second-generation 5G SoC Tiger T7520 released by UNISOC will be commercialized on a large scale, we will also usher in the large-scale popularization of 5G mobile phones.

  

Ziguang: Don’t even think about opening a 6nm chip without $200 million

How about a 5G SoC built over $200 million?

On Wednesday, Ziguang Zhanrui released the second-generation 5G smartphone platform Tiger Ben T7520, which is the world’s first chip using the 6nm EUV process. Advanced craftsmanship also means expensive. Chu Qing, CEO of Ziguang Zhanrui, said at the press conference: “If you don’t have 200 million US dollars, don’t even think about opening a 6nm chip.”

The cost of tape-out alone exceeds 200 million US dollars, and the overall cost of 5G SoC exceeds 200 million US dollars – Tiger Ben T7520, the CPU uses 4 Arm Cortex-A76 cores, 4 Arm Cortex-A55 cores, and the GPU uses Arm Mali-G57 cores.

  

Ziguang: Don’t even think about opening a 6nm chip without $200 million

In terms of 5G performance, based on UNISOC’s new-generation 5G technology platform Makalu, the Tiger Ben T7520 supports 5G NR TDD+FDD carrier aggregation, as well as uplink and downlink decoupling technology, which can improve the coverage by more than 100%. At the same time, it supports Sub-6GHz frequency band and NSA/SA dual-module network, and supports 2G to 5G seven-mode full Netcom. In SA mode, the downlink peak rate exceeds 3.25Gbps. It also supports dual SIM dual 5G and EPS Fall back, VoNR HD voice and video calls.

AI performance, the Tiger Ben T7520 integrates a new generation of NPU, which achieves excellent power consumption control compared to the previous generation, and the energy efficiency (TOPS/W) is improved by more than 50% compared with the previous generation.

In terms of multimedia processing performance, the Tiger Ben T7520 is equipped with the sixth-generation image engine Vivimagic solution and the second-generation FDR (Full Dynamic Range) technology independently developed by UNISOC, a dedicated AI acceleration processor, and a newly upgraded quad-core ISP architecture. Supports ultra-high resolution up to 100 million pixels and multi-camera processing capabilities.

In addition, the Tiger Ben T7520 adopts a new generation of multi-core Display architecture, supports a refresh rate of up to 120Hz, full-channel, full-format HDR standard rendering capabilities, and multi-screen display can support up to 4K HDR 10+, which can greatly improve users in high frame rate competitions. Experience in visually immersive scenes such as games, 5G ultra-high-definition video viewing, and AR/VR.

In terms of security, the Tiger Ben T7520 adopts the second-generation integrated security solution of Zhanrui, which integrates the financial-grade iSE security unit into the SOC. Compared with the external SE, it is more difficult to attack and locate and has higher security.

Among the six features, we focus on technology, 5G performance and AI.

The world’s first 6nm EUV chip will be mass-produced this year

6nm is unfamiliar to most people, because the most advanced semiconductor processes currently in commercial use are 7nm and 7nm EUV, and many processors will switch to the 5nm node this year. During TSMC’s China Technology Forum last year, TSMC’s global president Wei Zhejia revealed that after 7nm+, TSMC’s first launch was not 6nm but 5nm.

  

Ziguang: Don’t even think about opening a 6nm chip without $200 million

Wei Zhejia explained that the reason why 6nm (N6) chose to launch after 7nm+ and 5nm is to use the experience of 7nm+ and 5nm, so that 6nm has better logic density than 7nm+, and is compatible with 7nm IP, using the 7nm+ process. IP can continue to use the 6nm process, reducing process complexity and reducing costs.

Lei Feng.com also learned that in TSMC’s planning, 7nm will be a transition node, and 6nm is a major node, which is expected to play an important role for a long time.

In other words, UNISOC’s second-generation 5G SoC chose a future mainstream node, which is a reasonable choice to reduce risks.

  

Ziguang: Don’t even think about opening a 6nm chip without $200 million

Chu Qing, CEO of Ziguang Zhanrui

Chu Qing explained that EUV is a revolutionary improvement for lithography machines. It has brought Moore’s Law back to life. The industry’s first process node using EUV is 7 nanometers. We did not choose 7 nanometers, but 6 nanometers. This is because 6 nanometers has reached a more mature new node for the use of EUV, and its technical advantages are very sufficient.

Use numbers to reflect this quantitative advantage. Compared with the previous 7nm, the density of 6nm EUV transistors has increased by 18%, which will enable the integration of more transistors per unit area of ​​the chip, reduce chip power consumption by 8%, and provide longer battery life. time.

  

Ziguang: Don’t even think about opening a 6nm chip without $200 million

In the long run, Ziguang Zhanrui can reduce costs. TSMC has said that 6nm will play an important role for a long time. Chu Qing also said that the cost of tape-out 6nm chips is at least $200 million. Combining the statements of the two parties, it can be understood that although the cost of UNISOC’s first 6nm EUV is as high as 200 million US dollars, the IP using this process can still be reused for a long time in the future, and it can save a lot in the future. Development costs. From the perspective of UNISOC’s overall 5G strategy, it is undoubtedly a choice to reduce risks and increase returns.

It is reported that the Tiger Ben T7520 will be mass-produced within this year.

5G coverage is doubled, and power consumption is reduced by 35%

What 6nm EUV can bring is an improvement in the performance and power consumption of the entire SoC. Specifically, in 5G, what improvements does the new generation of platforms bring? In an interview with Leifeng.com (public account: Leifeng.com) and other media, Zhou Chen, executive vice president of Ziguang Zhanrui, made it clear that the 5G modem integrated in the Tiger Ben T7520 is not the Ivy V510, but is based on a new generation of Makalu platform. But he did not disclose the specific name of the new generation of 5G baseband.

  

Ziguang: Don’t even think about opening a 6nm chip without $200 million

Zhou Chen, Executive Vice President of UNISOC

However, the 5G capabilities of the new generation platform are obviously more powerful and more practical. One of the highlights is that the integrated full-scene coverage enhancement 5G modem of the Tiger Ben T7520 supports 5G NR TDD+FDD carrier aggregation, as well as uplink and downlink decoupling technology, which can improve the coverage by more than 100%.

  

Ziguang: Don’t even think about opening a 6nm chip without $200 million

What is the significance of carrier aggregation? Chu Qing explained that for mobile scenarios, such as cars on high-speed kilometers or high-speed trains, FDD is very advantageous. If it is in the scenario of high-density communication, TDD can show unparalleled advantages in spectrum utilization.

One of the features of the latest generation baseband Snapdragon X60 released by Qualcomm last week is support for TDD and FDD carrier aggregation.

In addition, Ziguang Zhanrui has a particularly important innovation. Chu Qing said: “Uplink enhancement technology is also a particularly important innovation of the Huben T7520. We have enhanced the uplink transmit power, including some new frame technologies to enhance it. After the enhancement, the uplink and downlink signal quality is as good, even if the Small wireless devices powered by lithium batteries are also comparable to base stations powered by fair electricity.”

This technology can increase the upload rate by 60% for the near point of the community, and solve the pain point of enhanced VR, 4K/8K ultra-high-definition video live broadcast and other services that require larger uplink bandwidth.

Zhou Chen also introduced, “When using 5G, it may appear in a certain position that we see that the signal displayed on the mobile phone is good, but it just doesn’t feel smooth. This is because the transmission power of the mobile phone and the base station power are inconsistent in the high frequency band. As a result, some points can receive the signal of the base station, but the data cannot be sent to the base station. Our full-scene coverage enhancement technology allows users to clearly feel that based on our full-scene coverage enhancement technology, the experience of data transmission signals can be improved. To achieve a 100% increase in the coverage of the up and down, to achieve a balance between the up and down.”

However, if power consumption increases with performance, it will be unacceptable to consumers. However, the data given by Ziguang Zhanrui shows that compared with the previous generation of the Tiger Ben T7510, the overall power consumption of the Tiger Ben T7520 is reduced by 35% in the 5G data scenario, and the power consumption in the 5G standby scenario is reduced by 15%.

The reduction in power consumption mainly comes from technical improvements in three aspects. Zhou Chen said in an interview: “First of all, thanks to the most advanced 6nm EUV process we have adopted, this has brought at least 8% power consumption reduction. Second, multi-mode integration has made 5G and previous generations of communication technologies all done. Well integrated, this fusion is further improved on the basis of the previous generation Makalu platform, and the upgraded fusion architecture can reflect the best performance, stability and power consumption. Also, we have a lot of detailed allocation technologies To match different scenarios, and using AI technology, the 5G baseband is also intelligently allocated to achieve the effect of reducing power consumption.”

Chu Qing added, “Reducing power consumption first requires more efficient hardware, but ultimately the user experience largely depends on software. Software needs to make accurate judgments and allocate different resources according to different scenarios. We use AI technology to The scene makes intelligent judgments, and I hope that the battery life of 5G mobile phones can be the same as or even longer than that of 4G.”

  

Ziguang: Don’t even think about opening a 6nm chip without $200 million

NPU performance can reach more than 8TOPS

When Ziguang Zhanrui released the Tiger Ben T710 application processor in August last year, its AI benchmarking score topped the AI ​​Benchmark running score of ETH Zurich. The newly released Tiger Ben T7520 integrates a new generation of NPU. Compared with the previous generation platform, the computing power has been greatly improved, and at the same time, the innovative architecture design has achieved better power consumption. The official statement is that the energy efficiency has increased by more than 50% compared with the previous generation.

  

Zhou Chen revealed that the performance provided by the Tiger Ben T7520 NPU is at least double that of 4TOPS.

Why do you need such AI computing power? Judging from the current situation, 5G will bring various real-time high-definition videos with higher resolution, and AR and VR are also expected to explode with the popularity of 5G. Zhou Chen said: “From a technical point of view, to achieve real-time high-definition video segmentation or other processing, at least 4TOPS is required, and AI applications will be superimposed, which requires higher AI computing power. We define Huben The T7520 was based on the needs of the next two or three years, so we provided such AI performance.”

Lei Feng.com, I also previously reported that the AI ​​IP launched by Arm last year provides 1-4TOP/s computing power.

Like 5G baseband, how to achieve higher AI performance while controlling high power consumption is also a big challenge. In this regard, Zhou Chen said: “We have done an overall analysis of the models used in the main scenarios of mobile phones and found that the most demanding performance requirements are real-time certain image vision algorithms. When these algorithms continue to work, It will generate a lot of energy and heat, which will have an impact on performance. We have done more hardware-level work for this type of scene during design, and used dedicated hardware circuits to ensure that scenes with particularly high performance requirements have Higher efficiency, and finally a relatively better energy efficiency ratio.”

UNISOC will promote the popularization of 5G mobile phones

It can be seen that the latest generation of UNISOC 5G SoC, although the CPU, GPU and baseband are not the top in the industry, still shows good competitiveness. Of course, this is related to the positioning and goals of UNISOC, Chu Qing said, “The 5G technology of UNISOC is the same as that of first-tier manufacturers, but our goal of entering the market is different, and some manufacturers are leading the way by holding high the technology banner , Ziguang Zhanrui is to serve the largest number of users, which is our positioning.”

Tsinghua Unigroup is currently promoting the popularization of 5G with its first-generation 5G solution, the Huben T7510 (Ivy V510 + Huben T710 application processor). This solution has been carried on the Hisense 5G mobile phone F50, which will also be launched soon.

In addition, China Unicom’s own brand 5G CPE VN007 using Ivy V510 has also been launched. This CPU can support 4G/5G wireless and wired Internet access at the same time. It has a built-in 5G full-band antenna and supports 5G mainstream frequency bands such as n78/n41/n79. The whole network coverage is basically achieved, the download rate can reach 2.3Gbps, the ring layout design, 360-degree signal coverage, and the price is only 999 yuan.

In addition, the terminal forms developed by OEMs and solution providers based on Ivy 510 include modules, MiFi, set-top boxes, AR, VR, IP cameras, industrial gateways, live broadcasters, automatic guided vehicles (AGVs), Drones etc. In 2020, dozens of 5G terminals equipped with Ivy V510 will be commercialized.

As for the official commercial time of the Huben T7520, Chu Qing said: “The Huben T7520 is developing a market strategy. In addition, we need to listen to customers’ opinions when it is appropriate to announce it.”

Then, when the first 6nm EUV 5G SoCial is mass-produced, the Tiger Ben T7520 with better performance and experience is applied on a large scale, and the entire 5G industry chain is more mature, we will usher in the large-scale popularization of 5G mobile phones.

The Links:   SKKD46-12 MG25J6ES40

How to improve the competitiveness of chip testing through independent ATE equipment?

Regarding the strength of my country’s semiconductors, it can be seen from a set of data. The total amount of chips imported by China has exceeded 200 billion US dollars for six consecutive years, and the annual import value of Chinese chips from 2018 to 2020 is about 300 billion US dollars. In 2020, China’s chip demand is about 350 billion US dollars, while China produces 56 billion US dollars, and the proportion of self-production is 16%. With the development of the import substitution situation, the slope of the snowball is high and long, and Chinese chips usher in a golden 10 years of development. Our goal is that by 2030, the scale of self-produced chips can reach 350 billion US dollars in the Chinese demand market of about 500 billion US dollars, and the self-produced proportion will reach 70%.

To achieve this ambition, all aspects of the chip need to work together. We all know that there are many links involved in a chip, including design, manufacturing, packaging and testing, and each link is critical to the final chip. Among them, chip testing is a key and necessary link from R&D to mass production, and it is also a major breakthrough in the development of semiconductors in my country.

 What is the pattern of the domestic chip testing market?

It has to be said that almost all chip industry chains now have a huge cake, and chip testing is no exception. According to the forecast of Gartner Consulting and CLSA: In 2025, the global chip testing service market is expected to reach 109.4 billion yuan, of which China’s chip testing service market will reach 55 billion yuan, accounting for 50.3%, and there will be more than 250 million in 5 years. billions of huge growth potential.

  How to improve the competitiveness of chip testing through independent ATE equipment?

Chip testing mainly includes two aspects of testing, wafer testing CP and finished product testing FT. Wafer testing CP is particularly important in multi-chip packaging scenarios, which can effectively avoid the failure of a single chip to cause other chips to be “burial” together; finished products Testing FT can effectively screen out the damaged chips during the packaging process. The two-pronged approach ensures the final chip quality. For high-end chips like 7nm, 5nm, and 3nm, chip testing is more important, which can realize a closed loop from R&D to mass production and guide chip design.

Of course, the equipment used in different testing processes is also different. The testing machine and probe station are mainly used in the wafer testing stage, and the testing machine and sorting machine are used in the finished product testing stage. In the entire ranks of test equipment, ATE is the core equipment for chip testing. Now, especially high-end chips, ATE test equipment is very much needed to ensure production. The total size of the chip ATE automated test equipment market alone has reached 7 billion US dollars.

However, in the market structure of ATE equipment, the voice of domestic enterprises is not optimistic. The two giants of the United States and Japan, Teradyne and Advantest, occupy a total of 90% of the market share, and the two have swept almost all well-known semiconductor companies.

  How to improve the competitiveness of chip testing through independent ATE equipment?

Domestic testing companies started more beautifully, and Japanese testing companies were about 40 years later. It is difficult for domestic equipment to be comprehensive in function and meet all usage scenarios. After decades of verification, foreign equipment can ensure that the equipment is stable and reliable, and can meet the long-term testing needs of various chips to the greatest extent. In addition, to develop fully functional test equipment, a lot of capital needs to be invested to increase performance, which is difficult for domestic companies that are not large enough.

Therefore, the status quo is that domestic test equipment companies have a large order-of-magnitude gap compared with the US and Japanese giants in terms of equipment introduction, company revenue, profits and employees. Take Huafeng Measurement and Control, the most mature and leading ATE test equipment manufacturer in my country, as an example, the following set of data can intuitively see the gap between domestic ATE equipment manufacturers and American and Japanese giants:

 How to improve the competitiveness of chip testing through independent ATE equipment?

How to improve the competitiveness of chip testing through independent ATE equipment?

On the afternoon of September 17th, the “Insimo Yangtze River Delta Empowering Industry Development” China (Nanjing) was jointly sponsored by the People’s Government of Yuhuatai District, Nanjing, China (Nanjing) Software Valley Management Committee, and undertaken by Innovo Market Information Consulting (Shanghai) Co., Ltd. ) Software Valley Integrated Circuit Industry (Shanghai) Investment Promotion Conference was successfully held in Pudong, Shanghai. At the meeting, Zhang Jingyang, chairman and CEO of Moore Elite, delivered a keynote speech on “How Independent ATE Equipment Improves the Competitiveness of Chip Testing Services”. Zhang Jingyang analyzed the situation of ATE equipment and testing services, and pointed out that the current chip testing modes are mainly divided into two types , mode one is a simple “equipment sales” mode; mode two is a “test service” mode. Both modes have different drawbacks. The “device sale” model is characterized by the fact that the device sold must cover all existing and potential chip testing needs, and is expensive, increasing customer decision and switching costs. The disadvantage is that it is difficult to quickly accumulate sales and installed capacity, and it is difficult to continuously invest in research and development for a long time; the characteristic of the “testing service” model is that the test factory purchases or leases test equipment, and the customer pays the service fee according to the current specific needs. But customer stickiness is low. The disadvantage is more obvious, that is, it is impossible to master the core technology of ATE equipment, and most of the profits are taken away by ATE test equipment companies.

  How to improve the competitiveness of chip testing through independent ATE equipment?

“The existing testing equipment and technologies are built on the original foundation. Only by innovating and establishing new rules can we have the opportunity to break the monopoly.” Zhang Jingyang pointed out, “To participate in global competition, you need to gather top international technical experts to create A professional testing team with combat effectiveness and strong comprehensive capabilities.”

  How to break the existing pattern of ATE test equipment?

In response to these pain points in the industry, Moore Elite proposed the exploration of the “independent ATE equipment + digital testing service” model. Zhang Jingyang explained that through his own research and development of ATE equipment, the equipment will not be sold, but leased to customers, adhering to the principle of “only renting, not selling” to provide customers with testing services. This is also the successful model of KYEC verification by KYEC, the world’s largest testing factory, with an annual sales of 6.8 billion yuan.

Zhang Jingyang said that this model can solve some of the difficulties of the existing model. On the one hand, it can promote ATE equipment through testing services: with innovative architecture ATE equipment technology as the core, through testing services, support Chinese chip companies to accelerate domestic substitution, and quickly increase the installed capacity of ATE equipment, obtain mass production data feedback, and optimize the performance of ATE equipment In turn, testing services can be improved through ATE equipment: recruiting top-level teams around the world, continuing to invest heavily in the research and development of top-level ATE equipment, providing digital testing services for chip companies, improving testing service levels, and improving chip quality.

From solution development, new product introduction to NPI to mass production maintenance, Moore Elite can provide flexible one-stop mass production services for the whole process of chip testing. Zhang Jingyang pointed out that domestic head mobile phone manufacturers and foreign RF giants benefit from this full-process test service model, thereby reducing test costs.

Moore Elite provides three flexible modes: Turnkey Mode, Backstage, and Revenue Share:

Test turnkey: The design company orders the testing business to Moore Elite, who will provide production services, and Moore Elite will use its own production capacity or other cooperative testing factories to help customers do mass production.

Background mode: The design company executes the mass production orders from the packaging and testing factory, and Moore Elite provides testing machines and testing solutions. Moore Elite rents the machine to the packaging and testing factory or customers, and the products are measured in the packaging and testing factory. Produce.

Sharing model: The design company places an order to the packaging and testing factory, Moore Elite Consign equipment enters the factory, and the income is divided with the packaging and testing factory.

  How to improve the competitiveness of chip testing through independent ATE equipment?

Moore Elite also intends to build a “DFT design + test development + ATE equipment” collaborative optimization one-stop ATE test platform. This platform can run through all links of the industry chain and continue to optimize, and can cover domestic and foreign mid-to-high-end chip design companies to the greatest extent. Testing needs from R&D to mass production.

How to improve the competitiveness of chip testing through independent ATE equipment?  

To achieve this goal is not overnight, nor can we build equipment from scratch, so where should we start from the specific practice?

  Standing on the shoulders of the Texas Instruments VLCT

In the mid-1990s, the testing department of Texas Instruments (TI) independently developed VLCT, a general-purpose chip automatic test equipment for internal use only. Since then, VLCT has experienced three development stages, providing important support for product development and company development. .

The first stage (before 2002): VLCT was rapidly promoted within TI, and gradually replaced the test products of LTX’s MegaTest, Teradyne’s J750, Eagle and other ATE machines; the second stage (2003~2008): VLCT was It has been improved into an instrument with ultra-low test cost for large-scale chips, covering all of TI’s advanced large-scale mobile terminal chips; VLCT also has the ability to test 90% of TI’s products, and almost 100% of TI’s wafer testing and testing. High-yield chip testing; Phase 3 (2009-2012): Almost all of TI’s new product testing and development was carried out directly on VLCTs, with the overall installed capacity exceeding 3,500 units, and VLCTs undertook more than 80% of the internal testing workload.

Today, the VLCT tester can cover most types of SOC chips/digital-analog hybrid chips/RF chip tests on the market, and most of them have a coverage rate of more than 90%, such as amplifiers, audio, data converters, interfaces, logic and voltage. Conversion, microcontrollers and processors, motor drives, power management, sensors, switches and multiplexers, and more.

VLCT test equipment can be said to have undergone the double test of time and practice. Its technology is mature, and it embodies the achievements of general-purpose ATE test equipment that TI has spent hundreds of millions of dollars in independent research and development in the past two decades. Secondly, its performance is reliable. It has been verified by large-scale long-term mass production of tens of billions of chips to meet the testing needs of mid-to-high-end chips. At present, VLCT continues to serve ATE testing of TI’s products on sale. Furthermore, it has strong versatility and abundant test resource configuration, which can cover most types of SOC chips/digital-analog hybrid chips/RF chip tests on the market. Finally, it is cost-effective. Compared with the same product, it can reduce the test cost by more than 1/2, and can replace the mid-to-high-end ATE of mainstream brands with lower configuration performance and cost.

For this reason, Moore Elite chose to acquire Texas Instruments’ VLCT equipment, introduce the world’s leading technology into China, and build its own ATE test machine. According to Zhang Jingyang, using VLCT test equipment has great advantages in operation management. The biggest performance is that its cost is only 1/10 of that of mainstream ATE testing services. Taking the 460-unit ATE ownership as an example, it can save testing operating expenses/increase net profit by 160 million.

  How to improve the competitiveness of chip testing through independent ATE equipment?

Regarding the Moore ATE test project, Moore Elite has full confidence. Because not only the addition of VLCT equipment, but also the core R&D personnel of VLCT are under the command of Moore Elite. It is reported that this project has a team of more than 50 top testing experts from around the world, from China, the United States and France.

The ATE equipment independently developed by Moore Elite is comparable to the high-end mainstream equipment in the international market. VLCT1.0 versions T0 and T1 can currently cover about 50%-60% of the industry’s mid-range chip testing needs, which are relatively advanced SoC testing machines in China. At present, the R&D team is developing the next-generation VLCT equipment products. Zhang Jingyang said that the product iteration is mainly to optimize the performance of the equipment through the continuous increase of new boards, and the second-generation products will cover 80% of the industry’s testing needs.

  How to improve the competitiveness of chip testing through independent ATE equipment?

The performance of the new generation of self-hosted VLCT2.0 is better than VLCT1.0 and the test equipment in the market. VLCT2.0 has carried out a series of technical upgrades, including new boards combined with self-designed board-level solutions, digital aspects can achieve up to tens of thousands of channels, and resources in analog aspects are significantly improved. VLCT2.0 embeds RF modules, Its application breadth has been greatly improved; the modularization method of stacking wood can provide flexible and large-scale model services; the desktop engineering machine allows rapid debugging, and can be seamlessly transferred to scalable mass production machines, etc.

In general, VLCT2.0 can be compared with the high-end models of the world’s leading manufacturers, can meet a wider range of customer needs, and can greatly shorten the time-to-market time. Moreover, the team has strong research and development strength, and the equipment is independently developed, which can greatly increase the machine speed and testing capacity. Zhang Jingyang believes that VLCT2.0 is expected to occupy the global chip high-end test market share, which will be the advanced general-purpose ATE equipment leading the industry trend in the next 20 years.

 Ten-year test business plan

Regarding the testing business, Moore Elite has a clear plan for ten years. According to Zhang Jingyang, the company expects to build its own ATE test equipment in 2021-2023. Master core technology and develop mid-to-high-end independent ATE equipment. Adopt the lane-changing overtaking mode, combined with testing services to increase the installed capacity of autonomous ATE equipment. Through mass production feedback, the matching degree of independent ATE equipment and domestic chip testing will be improved.

  How to improve the competitiveness of chip testing through independent ATE equipment?

From 2024 to 2025, the company will invest in the research and development of high-end ATE equipment. Completed the production of the world’s top testing machine VLCT2.0 and put it into use. Narrow the technical gap with the international top ATE, and then seize the global chip high-end testing market. At the same time, based on independent ATE equipment, the test service level is improved to help customers improve the quality of chips.

By 2026-2030, as mentioned above, Moore Elite wants to change the current form of the test equipment industry and create a digital test platform. At present, the equipment industry is equipment-centric. The equipment is developed first, and then the customer tests the product based on the equipment. But in fact, what the customer wants is not a particularly powerful equipment, but a cost-effective test solution. Moore Elite wants to focus on data and customer needs. Therefore, this is why Moore Elite adheres to the principle of “only renting and not selling” equipment. Its advantage is that if rented, it can continuously get feedback of data and guide the research and development of next-generation equipment.

By laying out the world’s top teams, mastering the core technologies of top ATE equipment, and building a digital chip test platform with “DFT design + test development + ATE equipment” collaborative optimization. Finally, through “cloud computing + digital intelligence”, the deep integration of artificial intelligence technology will improve the efficiency of the testing industry.

Epilogue

On the eve of China’s chip take-off, all links must not fall off the chain, and everyone is gathering firewood and the flame is high, and Moore Elite is improving the competitiveness of domestic chip testing through the service of independent ATE equipment.

 

The Links:   NL6448BC33-31D LM64P102

Scroll to top